At the Optical Fiber Communications Conference (OFC) 2024, Intel gave us a particularly interesting glimpse at what could be the future of chip and interconnect design. The Optical Compute Interconnect (OCI) chiplet integrates a Photonics Integrated Circuit (PIC) with an electrical IC. The chiplet was packaged with an Intel CPU and shown running live data.
Intel believes this technology is a game changer as it meets increasing demand for higher bandwidth across greater distances, while using less power. Of course, the initial applications will be used for AI infrastructure and HPC environments, where scalability concerns across racks and clusters are becoming increasingly apparent in large scale deployments.
Intel’s press release included the following statement: “As an analogy, replacing electrical I/O with optical I/O in CPUs and GPUs to transfer data is like going from using horse-drawn carriages to distribute goods, limited in capacity and range, to using cars and trucks that can deliver much larger quantities of goods over much longer distances. This level of improved performance and energy cost is what optical I/O solutions like Intel’s OCI chiplet emergi…